The Hong Kong Monetary Authority plans to conduct a tender for 2-year RMB Institutional Government Bonds on November 13, 2025, amounting to RMB1.25 billion. This initiative is part of the Infrastructure Bond Programme aimed at enhancing the city’s financial infrastructure. The bonds will be available to institutional investors, providing them with an opportunity to invest in government-backed securities. The issuance of these bonds reflects Hong Kong’s ongoing efforts to diversify its funding sources and support infrastructure development.
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